A low on-resistance SOI LDMOS using a trench gate and a recessed drain  被引量:2

A low on-resistance SOI LDMOS using a trench gate and a recessed drain

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作  者:葛锐 罗小蓉 蒋永恒 周坤 王沛 王琦 王元刚 张波 李肇基 

机构地区:[1]State Key Laboratory of Electronic Thin Films and Integrated Devices,University of Electronic Science and Technology of China

出  处:《Journal of Semiconductors》2012年第7期43-46,共4页半导体学报(英文版)

基  金:supported by the National Natural Science Foundation of China(Nos.60976060,61176069);the National Key Laboratory of AnalogIntegrated Circuit(NLAIC),China(No.9140C090304110C0905);the State Key Laboratory of Electronic Thin Films and Integrated Devices,China(No.CXJJ201004)

摘  要:An integrable silicon-on-insulator (SOl) power lateral MOSFET with a trench gate and a recessed drain (TGRD MOSFET) is proposed to reduce the on-resistance. Both of the trench gate extended to the buried oxide (BOX) and the recessed drain reduce the specific on-resistance (Ron, sp) by widening the vertical conduction area and shortening the extra current path. The trench gate is extended as a field plate improves the electric field distribution. Breakdown voltage (BV) of 97 V and Ron, sp of 0.985 mf2-cm2 (l/os = 5 V) are obtained for a TGRD MOSFET with 6.5/xm half-cell pitch. Compared with the trench gate SOI MOSFET (TG MOSFET) and the conventional MOSFET, Ron' sp of the TGRD MOSFET decreases by 46% and 83% at the same BV, respectively. Compared with the SOI MOSFET with a trench gate and a trench drain (TGTD MOSFET), BV of the TGRD MOSFET increases by 37% at the same Ron,sp.An integrable silicon-on-insulator (SOl) power lateral MOSFET with a trench gate and a recessed drain (TGRD MOSFET) is proposed to reduce the on-resistance. Both of the trench gate extended to the buried oxide (BOX) and the recessed drain reduce the specific on-resistance (Ron, sp) by widening the vertical conduction area and shortening the extra current path. The trench gate is extended as a field plate improves the electric field distribution. Breakdown voltage (BV) of 97 V and Ron, sp of 0.985 mf2-cm2 (l/os = 5 V) are obtained for a TGRD MOSFET with 6.5/xm half-cell pitch. Compared with the trench gate SOI MOSFET (TG MOSFET) and the conventional MOSFET, Ron' sp of the TGRD MOSFET decreases by 46% and 83% at the same BV, respectively. Compared with the SOI MOSFET with a trench gate and a trench drain (TGTD MOSFET), BV of the TGRD MOSFET increases by 37% at the same Ron,sp.

关 键 词:trench gate recessed drain ON-RESISTANCE breakdown voltage 

分 类 号:TN386[电子电信—物理电子学]

 

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