热固性聚苯醚树脂在高频印制电路板上的应用  

Application of Thermosetting Polyphenylene Oxide Resin for High Frequency Printed Circuit Boards

作　　者：霍刚[1] 

机构地区：[1]北京市化工研究院,北京100084

出　　处：《中国塑料》2000年第5期14-22,共9页China Plastics

摘　　要：介绍了高频印制电路板基材的介电性能要求和热固性聚苯醚树脂基材的制备 ,详细讨论了制备热固性聚苯醚树脂的两条技术路线及其树脂体系的特性 ,以及热固性聚苯醚树脂基覆铜板的特性 ,并简要介绍了热固性聚苯醚树脂基覆铜板的应用情况。The dielectric property requirement of high frequency printed circuit boards and preparation of thermosetting polyhenylene oxide resin are introduced.Two technical routes for preparing thermosetting polyphenylene oxide resin,the characteristics of each resin system,as well as the characteristics of copper clad laminate based on thermosetting polyphenylene oxide resin are discussed in detail.The applications of this laminate is also briefly presented.

关 键 词：热固性聚苯醚 介电性 高频印制电路板 覆铜板 

分 类 号：TQ326[化学工程—合成树脂塑料工业]