硫酸铜镀液镀铜机理概述  

Overview of mechanism of sulfate copper electroplating

作　　者：孙俊杰 田瑞杰 陆然 倪超 

机构地区：[1]深南电路有限公司,广东深圳518117

出　　处：《印制电路信息》2012年第3期40-44,共5页Printed Circuit Information

摘　　要：概述了硫酸盐镀铜的基本原理以及镀液组分的作用机理,同时给出电镀铜厚与电镀参数之间的依赖关系,对生产有一定的指导意义,希望能为新工艺的开发提供理论依据。This paper describes the basic principles of sulfate copper electroplating and the mechanism of action of the electrolyte composition. Meanwhile, the relationship of copper thickness and plating parameters for plating is given out, which has guiding significance in production with the hope of providing theoretical basis for development of new technology.

关 键 词：硫酸盐镀铜 作用机理 光亮剂 载运剂 整平剂 

分 类 号：TN41[电子电信—微电子学与固体电子学]