功率型LED封装用高分子材料的研究进展  

Research Progress of Polymer Materials for High-Power LED Encapsulation

作　　者：高南[1,2] 刘伟区[1] 闫振龙[1,2] 孙越[1,2] 陈海生[1] 

机构地区：[1]中国科学院广州化学研究所,广东广州510650 [2]中国科学院研究生院,北京100049

出　　处：《广州化学》2012年第2期39-45,共7页Guangzhou Chemistry

摘　　要：随着发光二极管(LED)亮度和功率的不断提高,封装材料已成为制约LED进入照明领域的关键技术之一。对于功率型LED封装材料,要求具有高折射率、高透光率、高导热率、耐紫外、耐热老化、低应力、低吸水率等性能特点。目前LED封装用两大主要高分子材料是环氧树脂和有机硅复合材料。对这两种材料的改性主要集中在折射率、耐老化性、导热性、吸水性和力学性能等方面。脂环族环氧树脂及纳米有机硅复合材料作为高功率LED封装材料具有广阔的发展前景。With the development of high-power light emitting diode （HP-LED）, the packaging material of LED has become an important key technique for LED lighting in daily life. As for high-power LED, the characteristics of high refractive index, high transmittance, high thermal conductivity, excellent UV/thermal resistance, low stress and water absorption are required. At present, the polymer materials for LED packaging mainly included epoxy resins and organosilicones, and a lot of researches about modifications of them are focused on improving the refractive index, aging resistance, thermal conductivity, water absorption and mechanical property to satisfy the demands of high-power LED packaging. Among the materials, cycloaliphatic epoxy resins and nano-composite of organosilicones have wide development prospections for high-power LED encapsulations.

关 键 词：功率型LED 封装材料 环氧树脂 有机硅 

分 类 号：O633.13[理学—高分子化学] O634.41[理学—化学]