温度对Sn-0.7Cu无铅钎料表面张力的影响  

Influence of Temperature on Surface Tension of Sn-0.7Cu Lead-Free Solder

作　　者：刘梁[1,2] 潘学民[1,2] 赵宁[1] 

机构地区：[1]大连理工大学材料科学与工程学院,辽宁大连l16023 [2]大连理工大学材料表面改性教育部重点实验室,辽宁大连116023

出　　处：《物理测试》2012年第4期32-35,共4页Physics Examination and Testing

基　　金：国家自然科学基金(50704009);中央高校基本科研业务费专项资金资助(DUT11SX06)

摘　　要：无铅钎料的表面张力是无铅钎料的重要物理性能之一。采用拉脱法测定Sn-0.7Cu无铅钎料的表面张力,同时采用RHEOTRONIC VШ型回转振动式高温熔体黏度仪测量Sn-0.7Cu无铅钎料黏度,通过黏度与表面张力之间的换算关系,从而计算得出Sn-0.7Cu无铅钎料表面张力。研究结果表明,Sn-0.7Cu无铅钎料表面张力随温度的增加呈现先下降后上升的变化趋势。The surface tension is one of the most important physical properties of lead-free solder. Pulling escape method is used to test the surface tension of the Sn-0.7Cu lead-free solder. And the RHEOTRONIC VIII type tor- sional oscillation viscometer for high-temperature melts is adopted to test the viscosity of the Sn-0. 7Cu lead-free solder; the surface tension of the Sn-0. 7Cu lead-free solder is calculated through the converting relation equation between viscosity and surface tension. It is shown that the surface tension of the Sn-0. 7Cu lead-free solder firstly decreases and then increases with the temperature keeping increasing.

关 键 词：Sn-0.7Cu无铅钎料 表面张力 拉脱法 黏度 

分 类 号：TG425[金属学及工艺—焊接]