键合线互连电路的优化设计  

Optimization Design of Bond-Wire Interconnect Circuit

作　　者：许向前[1] 毛伟[1] 朱文举[1] 

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050051

出　　处：《半导体技术》2012年第8期623-626,共4页Semiconductor Technology

摘　　要：介绍了一种微波多芯片组件中芯片与传输线互连的键合线互连电路设计。采用低通滤波器方法设计的键合线互连电路结构,在键合线长度一定的情况下,能够显著提高键合线互连电路的频率响应。设计了一种基于3阶低通滤波器的键合线互连电路,将键合线的寄生电感融入了3阶低通滤波器中,改善了键合线互连电路的微波传输特性,提高了键合线互连电路的截止频率。采用微波电路设计软件和三维电磁场软件相结合的设计方法,对键合线互连电路的微波特性进行建模、分析,验证了这种电路设计方法的正确性。A new design of bond-wire interconnect circuit was introduced in microwave multi-chip modules.The basic filter theory was used to develop the interconnect prototype.Compared with uncompensated interconnect,this interconnect could significantly extend the cutoff frequency of fixed-length bond-wire interconnects.This bond-wire interconnect circuit was designed based on a 3-order low-pass filter model.The parasitic inductance of the bond-wire interconnect circuit was bonded into the filter.The transmission characteristics of this circuit could be improved in microwave circuits.Microwave circuit design software and electromagnetic field software were used to model and analysis the microwave characteristics of this circuit.The correctness of this circuit was verified by the simulations.

关 键 词：宽带 键合线 微波多芯片组件(MMCM) 低通滤波器 优化 

分 类 号：TN454[电子电信—微电子学与固体电子学] TN305