聚异酰亚胺树脂合成条件的优化  

Optimizing the Synthetic Conditions of Polyisoimide Resins

作　　者：杨秀云[1] 崔婷婷[1] 李云辉[1] 孟祥胜[2] 杨慧丽[2] 范卫锋[2] 刘敬峰[2] 王震[2] 

机构地区：[1]长春理工大学化学与环境工程学院,长春130022 [2]中国科学院长春应用化学研究所高分子复合材料工程实验室,长春130022

出　　处：《应用化学》2012年第8期868-872,共5页Chinese Journal of Applied Chemistry

基　　金：国家自然科学基金资助项目(51173178);国家"九七三"项目(2010CB631100)

摘　　要：采用不同溶剂制备了苯乙炔基封端的聚异酰亚胺树脂,探讨了不同处理温度对聚异酰亚胺树脂(PⅡ)和相应的聚酰亚胺树脂(PⅠ)的熔体粘度及溶解性的影响。结果表明,不同处理温度对PⅡ的熔体黏度影响不大,但对溶解性有一定的影响,PⅡ在NMP和THF中具有良好的溶解性能。在相同处理温度条件下,PⅡ的熔体黏度低于PⅠ。随处理温度的增加,PⅡ低聚物的T5%随之增加,PⅡ在110℃处理的T5%为208℃,150℃处理的T5%为323℃,180℃处理的T5%为382℃,PⅡ固化后的T5%为550℃,显示出较优异的耐热性能。Phenylethynyl end-capped polyisoimide oligomers were synthesized in different solvents. The effects of different treatment temperature on melting viscosity and solubility of polyisoimide （PⅡ） and its corresponding polyimide （P I ） resins were discussed. The results showed that the effect of treatment temperature on melting viscosity of PⅡ was marginal but conceivable on solubility. The P lI exhibited excellent solubility in N-methylpyrrolidone （NMP） and tetrahydrofuran（THF）. The P I1 had less melt viscosity than P I at same treatment temperature. The T5% of P Ⅱ oligomer increased with the elevation of treatment temperature. The T5% is 208 °C, 323 °C and 382 °C when the temperature of P Ⅱtreatment is 110 °C, 150°C and 180 °C, respectively. While the T5% of cured P Ⅱ is 550 °C suggesting that had excellent heat resistance.

关 键 词：聚异酰亚胺 聚酰亚胺 溶解性 黏度 

分 类 号：O631[理学—高分子化学]