无铅喷锡(HASL)润湿不良问题及对策  

Poor wetting of Heat Air Solder Level problem and solution

作　　者：常成祥 王振荣[2] 

机构地区：[1]东莞康佳电子有限公司,广东东莞523685 [2]陕西省电子信息产品监督检验院,陕西西安710004

出　　处：《电子设计工程》2012年第15期124-127,共4页Electronic Design Engineering

摘　　要：针对东莞康佳电子有限公司生产无铅喷锡(HASL)PCB板时所遇到的焊盘润湿不良问题,采用了正常PCB板材与异常PCB板材对比,对smt生产制程条件进行内检等方法措施,以及最终对焊盘异常的PCB送国家级实验室5所分析结论确认焊盘润湿不良问题的主要表现为锡膏对PCB焊盘润湿不良,造成不良的主要原因与PCB焊盘HASL表面不平整以及焊盘已发生合金化降低其可焊性有关。并在批量生产中采取烘烤箱使用105±5℃,烘烤4小时烘烤PCB和使用酒精擦洗PCB焊盘来减少润湿不良的方法措施保证生产。This article in view of Dongguan Konka Electronics Company Limited production of Heat Air Solder Level PCB board encountered by the pad poor wetting problems. Using the normal PCB contrast with anomalies PCB, On SMT production process conditions were seized and other measures, And final send the poor wetting pad in PCBs to National Lab.5 Analysis confirmed the pad wetting the main show of the problem for the solder paste on the PCB pad poor wetting, The main cause of adverse with the PCB pad HASL surface roughness and pads have been alloying reduces its weldability, In mass production is adopted in the baking oven using 105±5℃ ,4 hours of baking PCB and the use of alcohol scrub PCB pads to reduce wetting method measures to ensure production.

关 键 词：HASL 热风整平 无铅喷锡 缩锡 润湿不良 拒焊 

分 类 号：TM205.1[一般工业技术—材料科学与工程]