一种用电晕放电仪实现PDMS改性与键合方法  

A kind of PDMS surface modification method by means of corona discharge

作　　者：丁继亮[1] 常洪龙[1] 陈方璐[1] 洪水金[1] 苑伟政[1] 

机构地区：[1]西北工业大学 陕西省微/纳米系统重点实验室,西安710072

出　　处：《功能材料与器件学报》2012年第3期187-191,共5页Journal of Functional Materials and Devices

基　　金：国家自然科学基金资助项目(No60976087)

摘　　要：聚二甲基硅氧烷(PDMS)的表面改性与键合是微流控芯片制作中的关键技术之一。本文比较分析了PDMS常用表面改性方法的优缺点,利用电晕放电仪在常温环境下产生的氧等离子体实现了对PDMS表面改性及不可逆键合,优化了电晕放电仪的表面处理参数,重点测试了PDMS分别与PDMS和PMMA之间的键合强度。并与紫外照射、表面活化剂等表面改性方法得到的键合进行了强度比较。键合强度测试结果表明:常温下氧等离子体表面改性效果略逊于真空环境中的氧等离子体表面处理,但是其键合强度达到700KPa,高于其它表面改性方法的键合强度。Surface modification and bonding of PDMS （polydimethylsiloxane） is one of the key technolo- gies in the domain of microfluidic fabrication. Three kinds of surface modification methods were analyzed and compared in this paper, and then PDMS bonding was achieved after modification by 02 plasma pro- duced by corona discharge in room air at atmospheric pressure. Surface treatment parameters of corona discharge were optimized and bonding strength between PDMS and PDMS, PMMA was tested. In addi- tion, bonding strength was compared with that of other modification methods. Burst pressure （ the maxi- mum pressure） tests results demonstrated that burst pressure from the bonding modified by corona dis- charge at room temperature can reach up to 700KPa, which was far higher than that from other modifica- tion methods.

关 键 词：PDMS 表面改性 键合 微流控 

分 类 号：TP212.1[自动化与计算机技术—检测技术与自动化装置]