羟基乙叉二膦酸电解液镀铜的研究和生产应用(Ⅰ)(待续)——镀铜工艺和电沉积机理  

The Study and Industry Application of Copper Electroplating from HEDP Bath (Ⅰ) ( to be continued)——Technology and Electroplating Mechanism of Copper Plating

作　　者：庄瑞舫[1] 

机构地区：[1]南京大学配位电化学研究所,江苏南京210093

出　　处：《电镀与精饰》2012年第8期10-13,共4页Plating & Finishing

摘　　要：回顾了羟基乙叉二膦酸电解液镀铜在国内的研究和生产应用概况。研讨了羟基乙叉二膦酸镀铜工艺的络合和电析机理。讨论了镀液与镀层的性能以及工艺操作条件与维护方法,并与氰化镀铜工艺作了比较。结果表明,加入CuR-1添加剂的羟基乙叉二膦酸镀铜工艺作为替代氰化镀铜是很有发展前途的无氰碱性镀铜新工艺。The study and industry application of copper electroplating from HEDP（1-hydroxyethylidene1,1-diphosphonic acid） bath in china has been reviewed and discussed.The coordination and electrodeposition machanism of copper from Cu-HEDP bath and the propenties of the bath solution and plate were described and compared with Cu-cyanide process.The operation condition and method for maintanance of the process were also discussed.The results show that the Cu-HEDP process（especially,having CuR-1 additive） is the preferred process for the replacement of Cu-cyanide process.

关 键 词：无氰镀铜 羟基乙叉二膦酸 镀铜络合剂 添加剂 

分 类 号：TQ153.14[化学工程—电化学工业]