热激励谐振式硅微结构压力传感器闭环系统  

The Closed Loop System of a Thermal Excited Silicon Microstructure Resonator Pressure Sensor

作　　者：樊尚春[1] 刘广玉[1] 

机构地区：[1]北京航空航天大学自动控制系,100083

出　　处：《测控技术》2000年第2期34-36,共3页Measurement & Control Technology

基　　金：航空科学基金;教育部留学基金

摘　　要：讨论了一种热激励谐振式硅微结构压力传感器闭环系统。该谐振式硅微结构压力传感器以方形硅膜片作为一次敏感元件 ;硅梁作为二次敏感元件。在硅梁谐振子的中部设置一电阻 ,作为热激励单元 ;在梁的根部设置一压敏电阻 ,作为拾振单元。基于该谐振式硅微结构压力传感器敏感机理 ,分析了信号的相互转换 ,给出了传感器闭环系统实现的条件。The closed loop system of a thermal excited silicon resonant pressure microsensor whose preliminary sensing unit is a square silicon diaphragm,and the final sensing unit is a silicon beam resonator,was investigated.The thermal excited resistor unit is located on the middle of the beam resonator and the piezoresistive detector unit is located on the end of the beam resonator.Based on the sensing mechanism of the above sensor,the signal transformation was investigated,and the realized conditions of the closed loop system are presented for the above sensor.

关 键 词：热激励 谐振式 闭环系统 硅微结构 压力传感器 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]