高精度贴片机贴片元件位置校正算法研究  

The Research on SMD Positional Correction Algorithm of High-precision Chip Mounter

作　　者：杨洪天[1] 高军礼[1] 阙艳红[1] 宋海涛[2] 

机构地区：[1]广东工业大学自动化学院,广东广州510006 [2]华南理工大学工商管理学院,广东广州510640

出　　处：《广东轻工职业技术学院学报》2012年第2期6-10,共5页Journal of Guangdong Industry Polytechnic

基　　金：广东省-教育部产学研项目(2011B090400577);企业横向课题(2010172)

摘　　要：由于制造和安装误差使得贴片机的贴装头以及吸嘴部件难以垂直于XY贴装平面。当校正贴片元件的角度时,其中心位置也同时发生变化,从而会严重影响最终的贴装精度。基于贴片元件的角度校正包括吸嘴本身的自转运动和吸嘴围绕吸嘴旋转轴心的公转运动这一事实,提出一种基于图像识别和圆拟合的校正算法。通过计算机仿真和工程实践应用证明,该算法可以满足高精度贴片机贴装位置精度的要求。The placement head and nozzle component in chip mounter are not perpendicular to XY plane ideally because of manufacture and assemble errors. When correcting the angle of chip component, the position of chip component changes synchronously, that will affecting the final mount accuracy badly. A correcting algorithm based on image recognition and circle fitting is proposed based on the fact that the angle correction of chip component ineludes the rotational motion of nozzle on its own axis and the rotational motion that nozzle moves round the rotational axis of nozzle. Through computer simulation and the application of engineering practice, it has proved that this algorithm achieved the positional accuracy requirements of high -precision chip mounter.

关 键 词：高精度贴片机 位置校正算法 贴片元件 图像识别 圆拟合 

分 类 号：TP206.1[自动化与计算机技术—检测技术与自动化装置]