提高隔离器焊接可靠性及驻波特性技术研究  

Research on Technology to Enhance the Solder Reliability and VSWR of Isolator

作　　者：赵夕彬[1] 吴家锋[1] 卢小娜[1] 

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050051

出　　处：《半导体技术》2012年第9期734-737,共4页Semiconductor Technology

摘　　要：高可靠固态功率放大器(SSPA)常采用隔离器来实现较好的驻波特性,为保证隔离器联接焊点能够承受上百次温度循环试验和高量级的随机振动试验,常采用Ω桥进行联接。针对隔离器搭桥焊接后驻波特性恶化的问题进行了设计和试验,提出了改善驻波特性的措施,提高了产品可靠性。论述了搭桥状态的匹配电路设计和焊接搭桥工艺的实现方法,满足了电路设计和可靠性设计要求,并对设计方案和可靠性进行了试验验证。试验结果表明,驻波比(VSWR)得到了较大改善,与搭桥前隔离器直接连接微带线的驻波特性一致,通过了100次-55～85℃温度循环试验和加速度总均方根值为207.1 m/s2的随机振动试验,电性能与可靠性满足设计要求。该技术研究成果为提高产品可靠性和隔离器的安装互连提供了设计依据。Isolator is commonly used for the high reliability solid state power amplifier（SSPA） to get excellent VSWR,and Ohm bridge was usually used to connect the isolator and microstrip so that the solder can bear hundreds of temperature cycle experiments and high level random oscillation experiments.Design and experiment are carried out to solve the issue due to the labefaction of the voltage standing wave ratio（VSWR） after the connection of the isolator and microstrip with Ω bridge,and the improvement measures for the characteristics of the VSWR were proposed to enhance the reliability of the SSPA.The implementation methods for the matching circuit design and solder process were discussed,and the circuit was obtained.Besides that,the reliability experiment for the SSPA was made.The experimental results show that the characteristics of the VSWR are improved greatly,a hundred times of the temperature cycle experiments from-55 ℃ to ＋85 ℃ and high level random oscillation experiments with the root mean square value of acceleration Grms of 207.1 m/s2 are passed,satisfying the design requirements.The research results provide reference for the reliability improvement of the SSPA and the connection of the isolator.

关 键 词：高可靠 固态功率放大器 隔离器 Ω桥 驻波 

分 类 号：TN722.75[电子电信—电路与系统]