表面贴装过程仿真系统的研究与开发  

Research and development of Simulation System for the Process of SMT

作　　者：黄靖[1] 解建伟[1] 

机构地区：[1]中国电子科技集团公司第五十四研究所,河北石家庄050081

出　　处：《计算机与网络》2012年第15期58-60,共3页Computer & Network

摘　　要：文章从表面贴装技术(SMT)现状及特点开始,介绍多品种小批量电子产品中使用表面贴装技术存在的问题。针对这一情况对表面贴装过程仿真系统的需求进行了分析,并详细论述了仿真系统的文件预处理、仿真以及数据库维护三大主要模块设计,主要介绍采用OpenGL实现仿真模块的方法,同时展示仿真系统实现结果。最后总结了仿真系统的特点。Based on the description of the present situation and characteristics of Surface Mounted Technology （SMT）, this paper introduces the problems when SMT is applied to the multi-varieties and small-batch electronic product. So this paper analyzes the demand of the simulation system for the process of SMT, and describes the design of three main modules such as document preprocessing, simulation and database maintenance. It mainly introduces the implementation method of simulation module by using OpenGL, and shows the result of the simulation system at the same time. The characteristics of this simulation system are summarized at last.

关 键 词：表面贴装技术 文件预处理 仿真 OPENGL 

分 类 号：TN05[电子电信—物理电子学] TP311.52[自动化与计算机技术—计算机软件与理论]