微连接技术在3D-WLP中可靠性的研究现状  

Research Status of the Reliability of the Micro-Joint Technology in 3D-WLP

作　　者：苌文龙[1] 于治水[1] 陈阿静[1] 经敬楠[1] 

机构地区：[1]上海工程技术大学材料工程学院,上海201620

出　　处：《微纳电子技术》2012年第9期624-629,共6页Micronanoelectronic Technology

基　　金：国家自然科学基金资助项目(50875160);上海市科委攻关项目(071005120);上海市教委重点学科项目(J51402);上海工程技术大学研究生科研创新项目(A-2603-11-01K185);低热输入熔钎焊过程的润湿行为和界面化学研究资助项目(12ZZ186)

摘　　要：为了研究新型技术对微连接可靠性的影响,阐述了微连接技术在倒装焊、热压力焊、硅通孔技术中的应用情况。对微连接技术在晶圆级封装(3D-WLP)中影响其可靠性的常见问题及主要因素进行了综述。分析表明,在常见的Sn基无铅焊料与Cu基板的反应过程中,金属间化合物层主要由Cu6Sn5和少量Cu3Sn组成。柯肯达尔孔洞、电迁移、金属间化合物的机械性能、锡须及尺寸效应是影响微连接可靠性的常见问题。在此基础上,归纳并探讨了焊料成分、微量合金、稀土元素、镀层及粉末精度等影响微连接可靠性主要因素的研究情况和发展趋势。In order to research the effect of the new technology on the reliability of the micro-joint,the application status of the micro-joint in the flip chip bonded,thermal pressure welding and through silicon via are introduced.Common problems and major factors of the micro-joint technology influencing the reliability of 3D-wafer level package（3D-WLP）are reviewed.The analysis shows that in the reaction process of Sn-based lead-free solders and Cu substrate,the intermetallic compound layer is mainly composed of Cu6Sn5 and a small amount of Cu3Sn.The Kirkendall voids,electromigration,mechanical properties of intermetallic compounds,tin whis-kers and size effect are the common problems to influence the reliability of the micro-joint.On the basis,the research situation and development tendency of the major factors to influence the reliability of the micro-joint,such as the solder composition,microelements,rare earth elements,coatings and powder precision,were proposed.

关 键 词：晶圆级封装(3D-WLP) 柯肯达尔孔洞 电迁移 尺寸效应 可靠性 

分 类 号：TN406[电子电信—微电子学与固体电子学]