军工电子元器件混装工艺的应用研究  

The Application Research of Military Electronics Components Mixed Process

作　　者：于宏辉[1] 吴从好[1] 陈永生[1] 

机构地区：[1]江苏自动化研究所

出　　处：《电子世界》2012年第16期34-36,共3页Electronics World

摘　　要：在国内外"绿色制造"的要求下,电子产品无铅化的推行愈演愈烈,诸多行业基本实现电子产品的无铅化。但是军工、航天以及医疗等领域基于高度可靠性的要求,仍然采用了有铅制程下的电子装联技术,而无铅元器件的广泛覆盖,使得实际生产过程中出现有铅元器件、无铅元器件混装的现象,本文将针对混装工艺的可靠性展开分析,并针对相关问题制定解决措施。In the request of ＂Green Manufacturing＂ at home and abroad, carrying out lead-free for electronic products is becoming increasingly fierce, numerous industries have already basically realized lead-free for electronic products.However, based on the requirement of high reliability in military, aerospace, medical and other fields, the electronic assembly technology in lead processing is still used.Simultaneously, the extensive coverage of lead-free components leads to appear lead components and lead-free components mixed phenomenon in practical production process.This paper analyses the reliability of mixed process, and formulates solving measures according to corresponding problem.

关 键 词：混装工艺 PCB镀层 无铅元器件 焊端镀层 无铅化 

分 类 号：TN6[电子电信—电路与系统]