喷射沉积SiC_p/6066铝基复合材料的固溶温度  

Solution Temperature of Spray Deposition for SiCp/6066 Al Composite

作　　者：龚浩然[1] 黎文献[1] 

机构地区：[1]中南工业大学材料科学与工程系,湖南长沙410083

出　　处：《金属热处理》2000年第6期15-16,共2页Heat Treatment of Metals

基　　金：国家九五科技攻关项目! ( 95-YS -0 0 5)

摘　　要：研究了喷射沉积体积分数 1 0 % SiCp/60 66铝基复合材料的固溶温度。结果表明 ,Mg和Cu在界面的富集致使复合材料的固溶温度和过烧温度均低于基体合金。该复合材料的最佳固溶温度为 51 5℃ ,且在 540℃过烧。In this paper,the solution temperature of spray deposition for 10%vol SiCp/6066 Al composites has been studied.The results show that the solution and over heating temperature of this material are lower than those of the base alloy because of the segregation of Mg and Cu to SiCp/6066Al interfaces.The optimum solution temperature of the composite is 515℃,and the over heating temperature is 540℃.

关 键 词：喷射沉积 复合材料 固溶温度 碳化硅 铝基 

分 类 号：TB333[一般工业技术—材料科学与工程]