陶瓷与金属扩散连接和场致扩散连接研究现状和进展  

Present situation and advance in development of diffusion bonding and field-assisted diffusion bonding of ceramic and metal

作　　者：潘瑞[1] 王清[1] 孙东立[1] 

机构地区：[1]哈尔滨工业大学材料学院,150001

出　　处：《焊接》2012年第9期13-16,46,共5页Welding & Joining

基　　金：国家自然科学基金(51172051)

摘　　要：连接技术是材料加工和实际工程应用的热点内容,而扩散连接技术是实现陶瓷和金属可靠连接的主导方法之一。主要介绍了扩散连接的工艺、接头元素扩散与界面反应以及残余应力分析等,并在此基础上简介了场致扩散连接的工艺及其界面反应机理,突出了其温度低、时间短、压力小以及简便的工艺特点。The diffusion bonding technology is one of the leading methods to realize the reliable joining of the ceramic to metal while the joining technology is an indispensable issue in material processing and engineering application.The diffusion bonding process,elements diffusion and interface reaction in joint and residual stress analysis were mainly introduced.The process of field-assisted diffusion bonding and the mechanism of interface reaction were presented based on that which exhibits advantages like low temperature,short time,low pressure and convenience.

关 键 词：扩散连接 场致扩散连接 连接工艺 界面反应 残余应力 

分 类 号：TG453[金属学及工艺—焊接]