无铅焊锡丝用低含量改性松香型无卤助焊剂  

Halogen-free flux with low content of modified rosin for the lead-free solder wire

作　　者：杨欢[1] 王丽荣[1] 肖文君 赵晓青[1] 黄德欢[1] 

机构地区：[1]南昌大学纳米技术工程研究中心,江西南昌330031

出　　处：《电子元件与材料》2012年第10期75-78,共4页Electronic Components And Materials

摘　　要：针对现有无铅焊锡丝用助焊剂松香含量过高、含有卤素和残留过多等问题,研制了一种以DL-苹果酸等为主要活性剂组分,以有机溶剂和少量改性松香为载体的新型无铅焊锡丝用助焊剂。测试结果表明:本助焊剂不含卤素,焊后残留较少,表面绝缘电阻达3.6×108Ω,可焊性好,焊点光亮饱满,满足手工焊接的工艺要求。By using DL-malic acid, etc. as the main active components, organic solvents and a small amount of modified rosin as the vehicle, a new flux especially for the lead-free solder wires was developed to resolve problems occurred in present fluxs, such as the high rosin content, containing halogen and excessive residues. Test results show that this new flux meets all of the manual soldering requirements, such as without halogen, a few of residue, high surface insulating resistance （3.6×10^8Ω）, good solder ability and forming full bright solder spot.

关 键 词：助焊剂 无铅焊锡丝 改性松香 铺展率 

分 类 号：TN604[电子电信—电路与系统]