以酒石酸钾钠为主络合剂的化学镀铜添加剂研究  

Study on the Additive for Electroless Copper Plating Taking the Potassium Sodium Tartrate as the Main Complexing Agent

作　　者：肖友军[1] 许永章[1] 

机构地区：[1]江西理工大学,赣州341000

出　　处：《表面技术》2012年第5期102-104,107,共4页Surface Technology

摘　　要：研究了以酒石酸钾钠为主络合剂的化学镀铜添加剂,讨论了甲醇、亚铁氰化钾、2,2′-联吡啶三种添加剂对镀液稳定性、镀层质量、沉积速率的影响,通过正交试验确定了各添加剂的用量。实验结果表明:在酒石酸钾钠为主络合剂的化学镀铜液中添加14mL/L甲醇、30mg/L亚铁氰化钾和5mg/L 2,2′-联吡啶,化学铜沉积30min后,沉积速率可达到4.6μm/h。在此工艺条件下,镀层呈现带光泽的淡粉红色,镀液稳定性佳,镀层附着力好。It studied the additive for electroless copper plating taking potassium sodium tartrate as complexing agen, and discussed the effect of CH3OH, K4 [Fe（CN）6 ]· 3H2O, 2,2＇-bipyridine on the stability of plating bath, the quality of electroplating layer, the deposition rate of plating, to determine the amount of additive. The results indicate that the optimal conditions of the electroless copper plating system as follows： CH3 OH is 14 ml/L, K4 [Fe（CN）6]·3H2O is 30 mg/L, 2,2＇- bipyridine is 5 mg/L, plating 30 min in the bath, the copper deposition rate reaches 4.6 μm/h, e lectroplating layer appears shiny pale pink, and stability of plating bath is optimal, electroplating layer has good adhe sion.

关 键 词：酒石酸钾钠 化学镀铜 添加剂 沉积速率 

分 类 号：TQ153.14[化学工程—电化学工业]