封装体热变形对POP装配工艺的影响  

Effect of Package Warpage for POP Assembling Technique

作　　者：邹雅冰[1] 罗道军[2] 

机构地区：[1]工业和信息化部电子第五研究所,广东广州510610 [2]中国赛宝实验室,广东广州510610

出　　处：《电子工艺技术》2012年第5期265-267,276,共4页Electronics Process Technology

摘　　要：POP装配形式的出现满足了移动通信产品小型化、功能集成及提高存储空间的需求,但是在焊接过程中,POP封装体热变形会对产品质量和可靠性带来不利影响。简单介绍了POP组装工艺流程,针对封装体热变形对组装工艺的影响展开试验和结果分析,并总结了减小封装体热变形的措施。POP stacking technique satisfied the demands of miniaturization, function integration and higher memory space for mobile communication products. However, the warpage of POP package during the soldering procedure will bring the unfavorable effects to quality and reliability of the products. Introduce the POP assembling procedure. Test and results analysis are aimed to the effect of package warpage on POP assembling technique, Summarize the measurements for minimizing the package warpage.

关 键 词：POP  热变形 阴影云纹测试 

分 类 号：TN605[电子电信—电路与系统]