焊膏厚度对CBGA组装板可靠性的影响  

Effect of Solder Paste Volume on Reliability of CBGA Assemblies

作　　者：吴懿平[1] 崔昆[1] 张乐福[1] 

机构地区：[1]华中理工大学材料学院,湖北武汉430074

出　　处：《电子工艺技术》2000年第4期153-156,共4页Electronics Process Technology

摘　　要：为了研究焊膏厚度对氮气保护再流焊CBGA组装板可靠性的影响 ,设计采用 0 .10mm、0 .15mm、0 .2 0mm三种厚度的焊膏和压缩空气与氮气保护再流焊来准备CBGA组装板可靠性试样。通过对组装板试样进行剪切强度、弯曲疲劳、热冲击和振动疲劳等可靠性试验来优化组装工艺过程。试验结果显示出 0 .15mm厚度的焊膏具有最佳的机械性能 ,氮气保护对改进组装板的性能起明显的作用。理论模型也定量给出了焊膏厚度与焊点性能之间的关系。In order to investigate the effect of stencil thickness and reflow ambient atmosphere on the reliability of ceramic ball grid array(CBGA)assemblies,three levels of stencil thickness,0.10 mm,0.15 mm,0.20 mm,and two levels each of ambient atmosphere,nitrogen and compressed air were used to prepare specimens.Properties of the assemblies,such as shear strength,bending fatigue life,thermal shock cycles and vibration fatigue life were tested to find out the optimum assembling process.The results show that assemblies prepared with stencil 0.15 mm thick yield maximized performance.And the nitrogen ambient atmosphere showed remarkable effect on improving the fatigue life.Theoretical models are given to qualitatively explain the relationship between the solder joint volume and performance.

关 键 词：陶瓷球栅阵列 可靠性 封装 焊膏厚度 印刷电路板 

分 类 号：TN410.594[电子电信—微电子学与固体电子学]