影响化学镀铜液稳定性和沉积速率的添加剂的筛选  

Screening Additives for Electroless Copper Plating of Acrylonitrile-Butadiene-Styrene Plastic —Perspective to Plating Bath Stability and Deposition Rate

作　　者：刘俊峰[1] 金玲[1] 胡弃疾[1] 

机构地区：[1]湖南科技大学化学化工学院,湖南湘潭411201

出　　处：《材料保护》2012年第10期59-61,1,共3页Materials Protection

摘　　要：目前,化学镀铜液的稳定性、沉积速率和镀层质量尚有一定欠缺,采用胶体钯为活化剂,以EDTA为主配位剂、酒石酸钾钠为辅助配位剂、甲醛为还原剂的镀液体系,对ABS板进行化学镀铜。通过试验确定了合适的添加剂,考察了基础溶液中分别加入盐酸胍、亚铁氰化钾、2,2’-联吡啶、复合稳定剂A(由2-巯基苯并噻唑、镍氰化钾、聚乙二醇、聚甲醛、硫脲等复配而成)后对镀液性能的影响,研究了每种添加剂含量对ABS树脂板镀层性能的影响。结果表明:亚铁氰化钾、2,2’-联吡啶使镀液的性能得到改善;添加剂A明显改善了镀液的稳定性和铜的沉积速度,镀液温度可以提高到50℃,生产效率提高,消除了甲醇的危害,改善了操作环境,得到的化学镀铜层具有良好的力学性能。A plating bath consisting of colloidal Pd as the activation agent,ethylene diamine tetraacetie acid as the major complexing agent,potassium sodium tartrate as the auxiliary complexing agent and HCHO as the reducing agent was adopted to prepare electroless Cu coating on the surface of acrylonitrile-butadiene-styrene(ABS) plastic sheets.The effects of additives guanidine hydrochloride,potassium ferrocyanide,and 2,2-bipyridine as well as composite additive A(consisting of 2-mercaptobenzothiazole,potassium nickel cyanide,polyethylene glycol,polyoxymethylene and thiourea) on the stability of the plating bath were investigated.Moreover,the effect of various additives on the properties of electroless Cu coating was also examined in relation to their content.Furthermore,additives suitable for electroless Cu plating of ABS plastic sheets were screened.Results indicate that additives potassium ferrocyanide and 2,2-bipyridine are able to improve the performance of the plating bath.Besides,composite additive A is able to greatly improve the stability of the plating bath(the temperature of the plating bath can be elevated to 50 ℃) and increase the deposition rate of Cu coating and production efficiency as well,and resultant Cu coating has good mechanical properties.

关 键 词：化学镀铜 ABS塑料 添加剂 沉积速率 镀液稳定性 镀层性能 

分 类 号：TQ153.1[化学工程—电化学工业]