一种具有滞回功能的低成本低功耗过热保护电路  

Low-cost and low-power OTP circuit with hysteresis

作　　者：张潭[1] 李为民 黄太宏 李林华[1] 赵建明[1] 

机构地区：[1]电子科技大学微电子与固体电子学学院,四川成都610054 [2]四川蓝彩电子科技有限公司,四川遂宁629000

出　　处：《物联网技术》2012年第10期60-63,共4页Internet of things technologies

摘　　要：给出了采用0.35μm BCD工艺设计具有热滞回功能的过热保护电路的具体方法,并利用Cadence Spectre仿真工具对电路进行了仿真。结果表明:在5V的工作电压下,其过热温度点为155℃,负向温度为100℃,在27℃时的功耗约为0.3mW。与传统过热保护电路相比,该电路具有功耗低、版图面积小等优点。A novel thermal-shutdown circuit with hysteresis was presented in this paper using 0.35 μm BCD technology. This circuit is simulated by Cadence Spectre. The simulation results show that the plus temperature is about 155℃ and the minus one is about 100℃ under 5 V supply. Meanwhile, the power dissipation is about 0.3mW. Compared with traditional OTP circuit, the circuit in this paper has lower power dissipation and smaller layout area.

关 键 词：过热保护电路 低功耗 热滞回 CADENCE Spectre 

分 类 号：TN402[电子电信—微电子学与固体电子学]