聚酯膜光接枝丙烯酸表面改性无钯化学镀铜  

Pd-free Electroless Copper Plating on PET Films Modified by Photografting Acrylic Acid

作　　者：潘湛昌[1] 张惠冲[1] 武守坤 李柱梁 邓剑锋 胡光辉[1] 肖楚民[1] 

机构地区：[1]广东工业大学轻工化工学院,广东广州510006 [2]惠州市金百泽电路科技有限公司,广东惠州516083

出　　处：《电镀与精饰》2012年第10期6-9,共4页Plating & Finishing

基　　金：广东省科技计划项目(2011B031000013);惠州市大亚湾区科技计划项目(20110111)

摘　　要：研究了聚酯膜光接枝丙烯酸表面改性化学镀铜。对比气相法光接枝和液相法光接枝,结果表明,使用气相法时丙烯酸可重复利用;使用表面全反射傅立叶变换红外光谱对聚酯膜进行了表征;通过接枝丙烯酸引入羧基,与银离子进行离子交换,能实现无钯活化引发化学镀铜,通过扫描电镜对化学镀铜层表面形貌进行观察。The electroless copper plating procress on PET films modified by photografling acrylic acid was investigated and the vapor-phase photografting method was compared with liquid-phase photografting method. The results shown that acrylic acid could be reused in the vapor-phase photografting method. PET films were characterized by FFIR-ATR technique. After photografting, carboxyl group was brought into the surface of PET films, and then was exchaged with silver ion so as to fulfill the Pd-free electroless copper plating process. Finally the surface topography of copper layer was observed by scanning electron micros- copy.

关 键 词：化学镀铜 表面光接枝 聚酯膜 丙烯酸 

分 类 号：TQ153.3[化学工程—电化学工业]