K-cor夹层结构制备工艺  

Manufacturing Processes of K-cor Sandwich Structure

作　　者：段沐枫[1] 李宁[1] 郑莹莹[1] 肖军[1] 李勇[1] 

机构地区：[1]南京航空航天大学材料学院,南京211106

出　　处：《宇航材料工艺》2012年第5期21-25,共5页Aerospace Materials & Technology

摘　　要：K-cor是应用Z-pin增强技术的一种新型高性能结构。本文以NHZP-1树脂为基体研究适合K-cor结构的半固化Z-pin拉挤工艺,得到固化度为51.25%的Z-pin为满足制备要求的最佳参数,并制作悬空装置采用两步法进行半固化Z-pin的植入和压弯,探索出压弯和后固化工艺。在此基础上,对试制的K-cor夹层结构进行平拉和剪切试验研究。结果发现,折弯长度是K-cor夹层结构的另一重要参数,较长的折弯长度会增加Z-pin与蒙皮的结合面积从而提高结构的拉伸性能。The K-cor sandwich construction is a new kind of foam sandwich structure reinforced by Z-pin tech- nique. There are seldom studies available at present. The NHZP-1 resin was used as matrix for partial-cured Z-pin＇ s pultrusion processing. 51.25% of the cure degree is the optimum parameter based on a series of experiments. And an impending device was made for insertion and flushing for the protruding pin using the two-step method. The param- eters of flushing and post-cure were also explored. On the basis of the completion, static shear and stretching tests were conducted under different loads. The pin flattened length is also critical for the configuration. The increased bonded area between Z-pin and the two skins can enhance the resistance of stretching test behavior.

关 键 词：复合材料 半固化Z-pin K-cor夹层结构 制备工艺 力学性能 

分 类 号：TQ327.1[化学工程—合成树脂塑料工业]