锡铜无铅焊料在电路板组装中的应用  

The Application of Tin-Copper Lead-free Solder in PCB Assembly

作　　者：蔡克新[1] 

机构地区：[1]中国电子科技集团公司第二研究所,太原030024

出　　处：《电子与封装》2012年第10期7-9,18,共4页Electronics & Packaging

摘　　要：在无铅组装工艺中,大多数电路板组装厂优先采用低成本焊料合金。没有添加剂的锡铜无铅焊料本身存在局限性,可是添加某种成份后,就能克服锡铜焊料通常所遇到的不足之处。文章分析了几种锡铜焊料相对于SAC焊料的特点,并叙述了它们在波峰焊和手工焊接工艺中的应用情况。first. the the In Lead-free process, a substantial percentage of PCB assemblers select less costly solder alloys at Tin-copper solder without dopants has limitations, but the addition of certain elements helps to eliminate deficiencies normally seen with tin-copper solder. This paper discusses several tin-copper options and advantages they offer when compared with SAC based solder. And introduce how to use them in wave- soldering and hand-soldering process

关 键 词：无铅工艺 锡铜焊料 波峰焊 手工焊 

分 类 号：TN305.94[电子电信—物理电子学]