多晶硅热执行器阵列的宏模型  

Macromodel for Polysilicon Thermal Actuator Array\+*

作　　者：黄庆安[1] 章彬[1] 匡一宁 秦明 

机构地区：[1]东南大学微电子中心,南京210096

出　　处：《Journal of Semiconductors》2000年第9期904-913,共10页半导体学报（英文版）

基　　金：教育部优秀年轻教师基金资助项目!(编号 60 5)&&

摘　　要：建立了多晶硅热执行器阵列的宏模型 .利用热传导原理分析了执行器的电热特性 ,根据结构力学原理给出了执行器阵列的偏转及驱动力 .用多晶硅表面微机械加工技术制备了阵列并进行了测试 .执行器偏转的测量与实验吻合较好 .该宏模型可以用于分析、优化和设计热执行器阵列 .An analytical model is developed for a laterally\|driven polysilicon thermal flexure actuator array. An electroth ermal analysis has been first performed based on conduction heat transf er. Deflection and actuating force for the actuator array are then presented by elastic analysis of structures. A surface\|micromachined polysilicon thermal fle x ure array has been fabricated and tested. Experimental results for the deflectio n are in good agreement with theoretical predications except high input power . The macromodel may therefore serve as an efficient tool in the analysis and op timization of new designs as well as the operation of such an actuator array, le ading to the possibility of a significant improvement in performance.

关 键 词：多晶硅 热执行器阵列 宏模型 

分 类 号：TN304[电子电信—物理电子学]