溅射气压对Al-Sn-Cu涂层电化学性能的影响  

Electrochemical Corrosion Resistance of Al-Sn-Cu Coatings

作　　者：于佃荣[1] 江强[1] 周细应[1] 

机构地区：[1]上海工程技术大学材料工程学院,上海201620

出　　处：《腐蚀与防护》2012年第11期952-954,959,共4页Corrosion & Protection

基　　金：上海市教委科技发展基金(11CXY57);上海市重点学科建设项目(J51402)

摘　　要：通过调节溅射气压,在不锈钢基底上获得了一系列Al-Sn-Cu合金涂层。采用电化学分析仪测试了所获得涂层的电化学腐蚀性能。结果表明,Al-Sn-Cu涂层随着溅射气压的增高,耐腐蚀性降低,低溅射气压筛下制备的涂层具有良好的耐腐蚀性能。Al、Sn含量的增加能改善膜层的耐腐蚀性能。A series of Al-Sn-Cu coatings were prepared by adjusting the sputtering pressure, and the electrochemical corrosion properties of the coatings prepared by different sputtering pressures were investigated. The results showed that the corrosion resistance of AI-Sn-Cu coating became lower with the increase of sputtering pressure. Coatings prepared by lower sputtering pressure have good corrosion resistance. The increase of Al and Sn can improve the corrosion resistance of the coatings.

关 键 词：涂层 电化学腐蚀 磁控溅射 

分 类 号：TG174[金属学及工艺—金属表面处理]