一种非致冷红外探测器真空封装的研究  

Study on vacuum packaging of an uncooled infrared detector

作　　者：闫浩[1] 朱魁章[1] 仰叶[1] 

机构地区：[1]中国电子科技集团公司第16研究所,合肥230043

出　　处：《低温与超导》2012年第11期33-36,共4页Cryogenics and Superconductivity

摘　　要：介绍了一种非致冷红外探测器杜瓦组件的封装设计;对探测器件在真空封装过程中的关键工艺技术进行了比较深入的分析;阐述了影响组件真空寿命及可靠性的因素以及解决措施。A kind of packaging design of uncooled IR detector Dewar component was introduced in this paper. The key processes of Packaging the detector at the condition of vacuum were analysed in detail. The factors which effects the vacuum life and the reliability of the component were described and resoved.

关 键 词：非致冷红外探测器 封装 杜瓦 真空寿命 

分 类 号：TN215[电子电信—物理电子学]