基于SOPC嵌入式系统中软硬件协同设计方法研究  

Study on Method of Software-Hardware Co-design Based on SOPC in Embedded Systems

作　　者：张丹[1] 董雷刚[1] 祝裕璞[1] 张华[1] 程书伟[1] 王冬星[1] 

机构地区：[1]大庆师范学院计算机科学与信息技术学院,黑龙江大庆163712

出　　处：《大庆师范学院学报》2012年第6期40-44,共5页Journal of Daqing Normal University

基　　金：黑龙江省教育厅科学技术研究项目(12523003)

摘　　要：软硬件协同设计方法克服了传统设计方法的缺点,使嵌入式系统的设计效率更高,速度更快。通过研究嵌入式系统中基于SOPC的软硬件协同设计方法,论述了软硬件协同设计方法的特点,并且对设计流程中的系统任务描述、系统软硬件划分、软硬件协同综合、软硬件协同仿真等各个阶段进行了阐述,最后对软硬件协同设计的工具进行了介绍。The method of software and hardware co-design overcome the limitation of the tradition method.It makes the speed more faster and the efficiency more higher in embedded systems.This paper discusses the mothed and characteristics and the of software-hardware co-design based on SOPC in embedded systems.This paper also discusses each stage of the design flow.It includes system task description,Software-Hardware partition,software-Hardware co-synthesis,software-hardware co-simulation.At last,this paper introduces the toos of software-hardware co-design.

关 键 词：SOPC 软硬件协同设计 嵌入式系统 FPGA 软硬件划分 

分 类 号：TP302.1[自动化与计算机技术—计算机系统结构]