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作 者:杨潇薇[1,2] 张云望[1] 安茂忠[2] 张林[1]
机构地区:[1]中国工程物理研究院激光聚变研究中心,绵阳621900 [2]哈尔滨工业大学化工学院,哈尔滨150001
出 处:《无机化学学报》2012年第12期2617-2625,共9页Chinese Journal of Inorganic Chemistry
基 金:the Research Center of Laser Fusion under China Academy of Engineering Physics in Mianyang for the financial support~~
摘 要:开发了以5,5′-二甲基乙内酰脲(DMH)为配位剂的无氰电镀金工艺。利用扫描电镜(SEM)和线性扫描伏安曲线对电镀时间和添加剂(由丁炔二醇、糖精和十二烷基硫酸钠组成)对镀金层表面、断面形貌和镀液性能的影响进行了测试,结果表明随着电镀时间的延长镀金层表面形貌几乎没有发生变化,光亮剂的加入增大了阴极极化同时使镀金层结晶变得细致均匀,在由HAuCl4,DMH,K3PO4和KH2PO4组成的基础镀液中金的沉积速度可达0.3μm.min-1,镀液中添加剂的加入没有影响金的沉积速度。利用X射线衍射技术(XRD)和X射线光电子能谱技术(XPS)对镀金层性能进行了测试,结果表明镀金层沿着(111)晶面择优生长并且由纯金组成。利用循化伏安曲线和旋转圆盘电极对Au(Ⅲ)在镀液中的电化学还原机制进行了研究,结果表明当研究电极为玻碳电极(GCE),镀液温度为45℃时,镀液中金的电沉积过程是受扩散控制的不可逆的过程。同时利用循环伏安曲线对镀金液的稳定性进行了分析。The effect of plating time and brightening additives (composed of saccharin, butynediol and sodium dodecyl sulfate) on the properties of gold deposits plated from a non-cyanide bath with 5, 5'-dimethylhydantoin (DMH) as the complexing agent was investigated by using scanning electron microscopy (SEM) and linear sweep vohammetry measurements. The results indicate that surface morphologies of gold electrodeposits are not markedly affected and do not change significantly with increasing deposition time, and brightening additives increase the cathodic polarization of bath and refine the grains of electrodeposits. The gold deposition rate in basic bath containing HAuC14, DMH, K3PO4, KH2PO4 is 0.3 μm ·min^-1, and the high deposition rate is not influenced by the introduction of brightening additives. The properties of electrodeposits were evaluated by X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS). The results show that the gold electrodeposits have a preferential orientation along (111) direction and are composed of pure Au^o state. The electrochemical behavior of Au(m) in the bath onto glassy carbon electrode (GCE) at 45 ℃ was studied by cyclic voltammetry and standard rotating disk. The results indicate that the electrodeposition of metallic Au in the bath is an irreversible process and is controlled by the diffusion of Au (lid onto GCE. The stability of the DMH-gold bath is also discussed.
关 键 词:电沉积金 无氰 5 5’-二甲基乙内酰脲 循环伏安 旋转圆盘电极
分 类 号:TQ153.1[化学工程—电化学工业]
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