镁合金微弧氧化层化学镀镍的镍盐活化工艺研究  

Study on Nickel Salt Activation Process for Electroless Nickel Plating on MAO Ceramic Layer of Magnesium Alloy

作　　者：郭锋[1] 尹建代[1] 李鹏飞[1] 

机构地区：[1]内蒙古工业大学材料科学与工程学院,呼和浩特010051

出　　处：《表面技术》2012年第6期62-64,67,共4页Surface Technology

基　　金：教育部高等学校博士学科专项科研基金项目(20091514110003)

摘　　要：通过差热分析、扫描电镜观察等手段,对镁合金微弧氧化层化学镀镍的镍盐活化工艺进行了研究,并与钯盐活化的效果进行了对比。结果表明:用镍盐对镁合金微弧氧化陶瓷层进行化学镀镍的活化是可行的,活化需要通过活化液室温浸泡和热还原两个步骤完成,活化液配方和热还原工艺是影响活化效果的重要因素;与钯盐活化相比,镍盐活化后化学镀镍的镀速低,最终形成的镀层厚度小,但有利于保持化学镀液在施镀过程中的稳定性。By the means of DSC and SEM, the nickel salt activation process for electroless nickel plating on MAO ce- ramic layer of magnesium alloy was studied, the activation effect of nickel salt was compared with that of palladium salt. The re- sults show that, nickel salt is practicable to activation of MAO ceramic layer before electroless nickel plating. The activation process includes impregnation in the activator at room temperature and thermal reduction two steps, the activator formula and the thermal reduction process are two important influence factors to activation effect. Comparing the activation effect of nickel salt with palladium salt, the deposition rate of electroless is lower and ultimate thickness of plating layer is thinner, however, the stability of plating solution is better during the plating.

关 键 词：镁合金 陶瓷层 化学镀镍 无钯活化 

分 类 号：TQ153.1[化学工程—电化学工业]