Ni元素对Sn2.5Ag0.7Cu0.1RE/Cu无铅微焊点界面IMC和力学性能的影响  

Effect of Ni on interfacial IMC and mechanical properties of Sn2.5Ag0.7Cu0.1RE/Cu solder joints

作　　者：李臣阳[1] 张柯柯[1] 王要利[1] 赵恺[1] 杜宜乐 

机构地区：[1]河南科技大学材料科学与工程学院,洛阳471003 [2]洛阳瑞昌石油经工设备有限公司,洛阳471003

出　　处：《焊接学报》2012年第11期39-42,115,共4页Transactions of The China Welding Institution

基　　金：国家自然科学基金资助项目(50774029);河南省高校杰出科研人才创新工程资助项目(2004KYCX020)

摘　　要：以Sn2.5Ag0.7Cu0.1RE无铅钎料为研究对象,借助扫描电镜和X衍射等检测方法研究了Ni元素对Sn2.5Ag0.7Cu0.1RE/Cu无铅微焊点界面IMC和力学性能的影响.结果表明,添加适量Ni元素能显著细化Sn2.5Ag0.7Cu0.1RE钎料合金初生β-Sn相和共晶组织,抑制焊点界面区(Cu,Ni)6Sn5金属间化合物的生长和表面粗糙度的增加,提高无铅焊点抗剪强度.当Ni元素添加量为0.1%时,钎料合金组织细小均匀,共晶组织所占比例较多;焊点界面IMC薄而平整,(Cu,Ni)6Sn5颗粒尺寸小,对应焊点抗剪强度最高为45.6 MPa,较未添加Ni元素焊点提高15.2%.The effects of Ni on the microstructure and mechanical properties of Sn2.5Ag0.7Cu0.1RE solder and solder joints were studied by using the scanning electronic microscope and X-ray diffraction.The results show that adding proper amount of Ni in Sn2.5Ag0.7Cu0.1RE solder alloys can refine the initial β-Sn phase and eutectic structure,suppress the growth of the(Cu,Ni)6Sn5 intermetallic compound(IMC) at the interface of solder joints,and reduce the roughness of interfacial IMC,improve the shear strength of the SnAgCuRE/Cu solder joints.The solder alloy structure was fine and homogenous,eutectic structure proportion was large,interfacial IMC was thin and flat and the grain size of(Cu,Ni)6Sn5 was small.The shear strength got the maximum value(45.6 MPa) when the Ni content was 0.1 wt%,which was 15.2% higher than the solder joints without Ni.

关 键 词：Sn2 5Ag0 7Cu0 1RExNi无铅钎料 焊点 金属间化合物 力学性能 

分 类 号：TG425[金属学及工艺—焊接]