微波介质陶瓷低温共烧技术的研究进展  

Research Progress in Low Temperature Co-firing Technology of Microwave Dielectric Ceramics

作　　者：吕学鹏[1] 郑勇[1] 周斌[1] 程鹏[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,南京210016

出　　处：《材料导报》2012年第23期146-149,154,共5页Materials Reports

基　　金：国家自然科学基金(51174118)

摘　　要：介绍了低温共烧陶瓷技术(LTCC)的特点及低温共烧技术对微波介质陶瓷的性能要求。总结了微波介质陶瓷实现低温共烧的主要方法,详细综述了典型微波介质陶瓷低温共烧技术的研究进展,指出了其目前存在的问题,并针对微波介质陶瓷低温共烧技术的发展方向提出了看法。Characteristics of low temperature co-firing ceramic （LTCC） technology and property requirements of microwave dielectric ceramics for LTCC applications are reviewed. The methods for reducing the sintering tempera- ture of the dielectric ceramics are introduced. The research progresses in low temperature co-firing technology of the typical microwave dielectric ceramics are reviewed. Additionally, existing problems and future prospects of the low temperature co-fired microwave dielectric ceramics are pointed out.

关 键 词：微波介质陶瓷 低温共烧 微波介电性能 烧结助剂 

分 类 号：TQ174.756[化学工程—陶瓷工业]