基于红外热成像与集成SVM的航空器电子板卡故障检测  

Aircraft Electronic Board Fault Detection Based on Infrared Thermal Imaging and Integrated SVM

作　　者：罗云林[1] 章翔[1] 

机构地区：[1]中国民航大学航空自动化学院,天津300300

出　　处：《测控技术》2012年第12期41-44,48,共5页Measurement & Control Technology

摘　　要：针对目前航空器电子板卡逐渐走向小型化、高度集成化的现状,提出一种基于改进的集成支持向量机LIBSVM的电路板红外热像成像故障诊断系统。通过对两块空客A330辅助动力装置(APU)中的微处理器印刷电路板(microprocessor PWB assembly A3)同时监测并采集温度数据,经过分类识别系统对升温过程进行匹配,能够更加准确、迅速地完成故障定位,节省了时间和成本,且易于掌握。In view of the current status of aircraft electronic board gradually tends to be small and highly inte grated, an infrared thermal imaging circuit board fault diagnosis system based on integrated support vector ma chine LIBSVM is designed and implemented. The two circuit boards（ microprocessor PWB assembly A3） mount ed on the Airbus A330 auxiliary power unit （APU） are monitored at the same time. The collected temperature data are used to match the temperature rising process through classification and recognition system. The experi mental results show that the diagnosis system can be more acculately and quickly complete the fault location while saving time and cost, and easy to grasp.

关 键 词：红外热成像 航空器电子板卡 故障诊断 支持向量机 

分 类 号：TP27[自动化与计算机技术—检测技术与自动化装置]