疏水性硅烷复合膜修饰的铜合金表面的防腐性能  

Anti-corrosion Property of Hydrophobic Organosilane Complex Film on Copper Alloy Surface

作　　者：王芳[1] 李跃飞[1] 刘俊俊[1] 王静[1] 李彦妮[1] 

机构地区：[1]西北农林科技大学理学院,陕西杨凌712100

出　　处：《材料科学与工程学报》2012年第6期880-883,共4页Journal of Materials Science and Engineering

基　　金：教育部留学回国人员科研启动基金资助项目(K314020902);中央高校基本科研业务费专项资金资助项目(Z109021008)

摘　　要：采用自组装方法,在铜合金表面首先制备了6-(3-三乙氧基硅基丙基)氨-1,3,5-三嗪-2,4-二硫醇单钠盐(TES)自组装薄膜,然后用正辛基三甲氧基硅烷(OTES)或十六烷基三甲氧基硅烷(HDTMS)对TES修饰的铜合金表面进行硅烷化处理,得到了具有疏水功能的复合自组装薄膜。通过傅里叶变换红外光谱(FT-IR)、接触角、循环伏安、极化曲线和扫描电子显微镜(SEM)对铜合金表面的自组装薄膜进行了表征。结果表明,与未处理的铜合金相比,经复合自组装薄膜修饰的铜合金表面接触角由89.4°上升到123.7°,提高了铜合金表面的疏水性;FT-IR表明了复合自组装薄膜在铜合金表面的形成;SEM测定结果表明该方法成功地在铜合金表面获得均匀致密的有机硅烷复合膜;循环伏安及极化曲线测试均表明了该复合膜有效地提高了铜合金的耐腐蚀能力。6-（3-triethoxysilylpropyl） amino-l, 3, 5-triazine-2, 4-dithiol monosodium （TES）, octyltriethoxysilane （OTES） and hexadecyltrimethoxysilane （HDTMS） were used to prepare single and complex self-assembled films on copper alloy surface. The films were characterized by means of FT-IR spectrum, contact angle measurement, cyclic voltammogram, polarization curve and scanning electron microscopy （SEM）. The results show that the contact angle of the copper alloy surface covered with complex film is up to 123.7° compared with 89.4° of bare copper. FT-IR spectra verifies the formation of complex self- assembled film on the copper surface. Cyclic voltammogram and polarization curves suggest that the corrosion resistance performance of the complex film is better than that of the single TES selbassembled film, and the protection efficiency is up to 96.54%.

关 键 词：铜合金 有机硅烷 复合膜 耐蚀性 

分 类 号：TQ153.1[化学工程—电化学工业]