铜箔材料的研究现状与发展  

Current Situation and Development of Copper Foil Material

作　　者：刘东辉[1] 廖钰敏[1] 张敬恩[1] 朱洪斌[1] 

机构地区：[1]江西理工大学材料科学与工程学院,江西赣州341000

出　　处：《热处理》2012年第6期14-17,共4页Heat Treatment

摘　　要：铜箔主要有压延铜箔和电解铜箔两种,在电子工业中应用广泛。压延铜箔的抗弯曲性能、导电性能和韧性等均好于电解铜箔,但生产成本较高压延铜箔用轧制法制作,而电解铜箔则可采用辊式连续电解法、环带式连续电解法或载体法制作。新制成的铜箔要经过表面处理后方能使用,表面处理方法有机械法、化学法和电化学法。高延展性铜箔、超薄铜箔和环保型涂树脂铜箔是铜箔的发展方向。The copper foils are mainly such two types as rolled one and electrolytic one, and have been widely applied to the electronic industry. The rolled copper foil is superior to the electrolytic copper foil in resistance to bending, conductivity, toughness and so on, but costlier relative to the latter. The rolled copper foil may be made by using rolling process, while the electrolytic copper foil may be made by means of roll-type continuous electrowinning, endless belt continuous electrowinning or carrier precipitation process. The freshly made copper foil is to be surface treated by mechanical procedure, chemical process or electrochemical process before practical service. The copper foil will be developed and become highly ductile, ultro-thin or resin-coated environmental friendly.

关 键 词：压延铜箔 电解铜箔 制作方法 表面处理 

分 类 号：TG146.11[一般工业技术—材料科学与工程]