小尺度薄型封装焊点失效机理和可靠性设计  

Improvement of Solder Joint Reliability for Thin Small Outline Package

作　　者：钱佳民[1] 徐闰[1] 汤敏燕[1] 

机构地区：[1]上海大学材料科学与工程学院,上海200072

出　　处：《上海大学学报（自然科学版）》2012年第6期561-566,共6页Journal of Shanghai University:Natural Science Edition

基　　金：上海市重点学科建设资助项目(S30107);航空科学基金资助项目(20100241007)

摘　　要：通过实验研究了印刷电路板(print circuit board,PCB)设计对小尺寸薄型封装(thin small outline package,TSOP)焊点可靠性的影响.实验制作了包含引脚焊盘的长度、焊盘的表面处理方式及背靠背的双面贴装偏移量3种设计参数的可靠性测试板,并采用表面贴装工艺(surface mount technology,SMT)将TSOP器件焊接到测试板上;经-40～85℃的高低温循环试验后,收集了TSOP引脚焊点裂纹的生长数据;讨论了焊点失效的机理,相应考虑了2种可靠性判断准则,并对各参数条件下的裂纹数据进行比较.结果表明,长尺寸焊盘、有机保焊膜(organic solderability preservatives,OSP)及不对称的两面布置方式有助于提高TSOP引脚的焊点可靠性.The influence of print circuit board design on solder joint reliability （SJR） of thin small outline package （TSOP） has been investigated in a specifically designed experiment. The S JR test board includes three layout parameters. The TSOP component has been soldered to the test board under surface mount process. Solder joints＇ crack length subject to each design parameter has been measured after the samples went through thermal cycling from -40 to 85 ~C. The mechanism of solder joint crack has been discussed. In addition, two judgment criteria are chosen according to the crack length. The results show that S JR of TSOP can be improved by long size pad, organic solderability preservatives （OSP） surface finish and offset double placement.

关 键 词：小尺寸薄型封装 焊点可靠性 失效机理 

分 类 号：V438.4[航空宇航科学与技术—航空宇航推进理论与工程]