膜法处理印制线路板PCB酸性含铜电镀废水  

Treatment of acid copper-containing electroplating wastewater using membrane

作　　者：刘久清[1] 刘海翔[1] 周钦[1] 

机构地区：[1]中南大学冶金科学与工程学院,湖南长沙410083

出　　处：《中南大学学报（自然科学版）》2012年第12期4605-4609,共5页Journal of Central South University:Science and Technology

基　　金：国家自然科学基金资助项目(20806094);湖南省自然科学基金资助项目(10JJ5007);湖南省科技计划重点项目(2010SK2011);长沙市科技局项目(K0902123-11)

摘　　要：采用纳滤膜和反渗透膜组合处理含铜酸性电镀废水,通过试验考察操作压力、流量、温度等对渗透通量和截留率的影响。研究结果表明:在合适的操作条件下,纳滤膜对Cu2+的截留率在96%以上;反渗透膜对Cu2+的截留率在98%以上。纳滤膜较佳操作条件为:温度26℃,操作压力1.5 MPa,流量16 L/min。反渗透膜较佳操作条件为:温度36℃,操作压力2.0 MPa,流量14 L/min。The nanofiltration （NF） membrane and reverse osmosis membrane （RO） were used to treat the copper-containing acid electroplating waste water produced by printed circuit board （PCB）, and the effects of trans-membrane pressure （TMP）, flow velocity and temperature on the permeate flux and Cu2＋ rejection were studied. The result shows that under optimal condition, Cu2＋ retention of NF is over 96% and that of RO is over 98%. The optimum operating conditions for NF membrane are as follows： temperature 26 ℃, TMP 1.5 MPa, flow velocity 16 L/min, and for RO membrane： temperature 36 ℃, TMP 2.0 MPa, and flow velocity 14 L/min.

关 键 词：纳滤膜 反渗透膜 印制线路板 铜 电镀废水 

分 类 号：X703.1[环境科学与工程—环境工程]