考虑损伤效应的无铅焊锡材料的率相关本构模型  

Rate-dependent Constitutive Model for Lead-free Solders Considering Damage Effect

作　　者：秦飞[1] 安彤[1] 王旭明[1] 

机构地区：[1]北京工业大学机械工程与应用电子技术学院,北京100124

出　　处：《北京工业大学学报》2013年第1期14-18,共5页Journal of Beijing University of Technology

基　　金：国家自然科学基金资助项目(10972012);国家科技重大专项资助项目(2011ZX02606-005)

摘　　要：考虑冲击过程中无铅焊锡材料试件中的损伤影响,根据实验数据确定了损伤演化参数,对原模型进行了修正,给出了Sn3.0Ag0.5Cu和Sn3.5Ag两种无铅焊锡材料考虑损伤效应的率相关本构模型.结果表明,修正后的模型与实验结果吻合较好.In this paper, the damage effect was considered into the impact process of lead-free solder specimens. Based on the experimental data, the modified rate-dependent Johnson-Cook model for the Sn3.0Ag0.5Cu and Sn3. SAg lead-free solders were derived. The stress-strain curves obtained from the modified Johnson-Cook material models and the experiments agreed quite well with each other. It indicates that presented modified Johnson-Cook models are suitable to describe the dynamic behavior of the two lead-free solder materials.

关 键 词：无铅焊料 本构关系 Johnson—Cook模型 损伤 

分 类 号：TB12[理学—工程力学] TN47[理学—力学]