快速凝固型Sn-Ag-Cu系钎料合金制备及钎焊工艺试验  

Preparation and soldering test for rapid solidification Sn-Ag-Cu solder alloy

作　　者：李攀[1] 张鑫[1,2] 刘治军[3] 高广东[3] 熊毅[1,2] 

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471023 [2]河南省有色金属材料科学与加工技术重点试验室,河南洛阳471023 [3]河南省中原内配股份有限公司,河南孟州454750

出　　处：《焊接技术》2012年第12期36-38,6,共3页Welding Technology

基　　金：河南科技大学SRTP资助项目(2011065)

摘　　要：采用单辊法制备了快速凝固型Sn2.5Ag0.7Cu钎料合金,在对其进行XRD检测、熔化特性测定和钎焊工艺试验后,对一定钎焊工艺条件下钎焊接头的力学性能和显微组织进行了测试分析,结果表明:所制备的钎料合金的熔化特性和钎焊接头力学性能满足要求,钎缝-母材界面上金属间化合物呈不均匀分布,且朝向钎焊缝中心生长。Rapid solidification Sn2.5Ag0.7Cu solder alloy was prepared by using single-roller method,after XRD-test and testing the melting property and soldering procedure,the mechanical properties and microstructure of the joints under given soldering conditions were tested and analyzed.The results showed that the melting property of the solder alloy and mechanical properties of the joint were satisfactory.The IMC located at the solder-parent metal interface had an uneven distribution,and they grew toward the center of the solder seam.

关 键 词：快速凝固 SN-AG-CU 熔化特性 抗剪强度 金属间化合物 

分 类 号：TG425.1[金属学及工艺—焊接]