喷射沉积电子封装用高硅铝合金的研究进展  

Research progress of spray deposited high Si-Al alloys for electronic packaging

作　　者：刘文水[1] 王日初[1] 彭超群[1] 莫静贻[1] 朱学卫[1] 彭健[1] 

机构地区：[1]中南大学材料科学与工程学院,长沙410083

出　　处：《中国有色金属学报》2012年第12期3446-3455,共10页The Chinese Journal of Nonferrous Metals

基　　金：国家军品配套项目

摘　　要：微电子技术的飞速发展对电子封装材料提出更高的要求,传统电子封装材料已难以满足现代封装需要。新型喷射沉积电子封装用高硅铝合金以其组织细小均匀、各向同性、热膨胀系数低、热导率高、密度低,且具有良好的机械加工、涂覆性能以及焊接性能等优良的综合性能成为研究焦点。主要探讨高硅铝合金的喷射沉积制备方法、组织性能和研究动态,并对其发展前景进行展望。The increasing development of modern microelectronic technology contributes to a higher demand for packaging materials.However,traditional ones can no longer work well for the modern packaging.A new series of spray deposition high Si-Al alloys developed for electronic packaging have attracted much attention for their remarkable comprehensive properties,such as combination of uniform small microstructure,low coefficient of thermal expansion,light mass and good machinability as well as easily coated and welded.The spray deposition process,microstructure,performance as well as research status were discussed,and the relevant problems and development tendency corresponding were also addressed.

关 键 词：高硅铝合金 电子封装 喷射沉积 热膨胀系数 热导率 密度 

分 类 号：TG146[一般工业技术—材料科学与工程]