电子材料界面裂纹的新型湿气压力模型  

Novel vapor pressure model for interface crack in electronic materials

作　　者：张旻澍[1] 李世玮[2] 卢智铨[2] 

机构地区：[1]厦门理工学院材料科学与工程系,福建厦门361024 [2]香港科技大学先进微系统封装中心

出　　处：《电子元件与材料》2013年第2期62-65,共4页Electronic Components And Materials

基　　金：福建省自然科学基金资助项目(No:2012J05100)

摘　　要：为了准确评估电子材料界面裂纹张开空间内的湿气压力,提出了一项新的压力计算模型。有别于传统模型,新模型充分考虑了电子材料界面裂纹扩展的物理过程,计算了湿气扩展至裂纹张开空间内的速率,并结合理想气体状态方程,推导了湿气压力与湿气扩散速率、裂纹张开度的关系。从模型的参数研究中可以发现,如果湿气对流比较缓慢或者裂纹张开度比较大,则湿气压力需要经更长的时间达到饱和。该模型的建立为界面裂纹扩展稳定性的研究,提供了湿气压力评估的理论依据和计算数值。In order to give the precise evaluation of vapor pressure in the interface crack opening zone in packaging of electronic materials, a novel vapor pressure model was proposed. Differing from most conventional models, this model studied the moisture transfusion process from the encapsulation molding compound into the crack opening zone. The moisture transfusion rate was also calculated. Correlated with the ideal gas law, the analytical solution of vapor pressure model was derived. From the parametric study, it is found that vapor pressure is strongly depending with the moisture convection and crack opening. The evaluation of vapor pressure from this newly developed model can be also used for later crack propagation study.

关 键 词：电子材料界面 湿气压力模型 湿气对流 界面裂纹 

分 类 号：TN601[电子电信—电路与系统]