无铅焊点金属间化合物的纳米压痕力学性能  

Nanoindentation properties of intermetallic compounds in lead-free solder joints

作　　者：秦飞[1] 安彤[1] 仲伟旭[1] 刘程艳[1] 

机构地区：[1]北京工业大学机械工程与应用电子技术学院,北京100124

出　　处：《焊接学报》2013年第1期25-28,32,共5页Transactions of The China Welding Institution

基　　金：国家自然科学基金资助项目(10972012)

摘　　要：研究Sn3.0Ag0.5Cu/Cu界面处的IMC在150℃下等温时效的生长情况,时效时间分别为100,300,500,1 000 h.拟合出IMC的厚度与时效时间的关系,采用纳米压痕仪进行纳米压痕试验,发现Cu6Sn5与Cu3Sn的变形机制不同.Cu6Sn5为非连续性塑性变形,表现为压痕过程中的锯齿流变;Cu3Sn的压痕曲线比较平滑.随Cu6Sn5厚度的增加,Cu6Sn5的弹性模量和硬度没有太大变化.对时效100,500 h后的Sn3.0Ag0.5Cu/Cu界面处的过渡区进行纳米压痕试验,发现Cu,Cu3Sn,Cu6Sn5和Sn3.0Ag0.5Cu的硬度大小顺序为Cu6Sn5>Cu3Sn>Cu>Sn3.0Ag0.5Cu.The growth of intermetallic compounds(IMC) at the Sn3.0Ag0.5Cu/Cu interface was investigated under isothermal aging temperature of 150 ℃ and aging time of 100,300,500 and 1 000 h,respectively.The relationship between the thickness of the IMCs layer and aging time was fitted out,and the growth law of the IMCs layer at Sn3.0Ag0.5Cu/Cu interface under isothermal aging condition was obtained.Mechanical properties of the Cu6Sn5 and Cu3Sn were obtained by a nanoindentation tester.It indicates that with the Cu6Sn5 thickness increasing,its Young's modulus and hardness have no significant change.The Young's modulus of Cu3Sn is greater than that of Cu6Sn5,but the hardness of Cu3Sn is lower than that of Cu6Sn5.The nanoindentation experiments of the Sn3.0Ag0.5Cu/Cu interfacial zone show that the hardness of Cu,Cu3Sn,Cu6Sn5 and Sn3.0Ag0.5Cu has an order of magnitude that is in sequence Cu6Sn5>Cu3Sn>Cu>Sn3.0Ag0.5Cu.

关 键 词：电子封装 金属间化合物 纳米压痕 力学性能 

分 类 号：TG425.1[金属学及工艺—焊接]