活性剂对锌基钎料助焊剂物理性能及铺展性能影响  

Effect of Active Agent on Physical Properties of Zn-based Flux and Spreadability of Zn_20Sn Solder

作　　者：纠永涛[1] 闫焉服[1] 盛阳阳[1] 李帅[1] 

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471023

出　　处：《河南科技大学学报（自然科学版）》2013年第2期8-12,6+5,共5页Journal of Henan University of Science And Technology:Natural Science

基　　金：国家自然科学基金项目(5117151);河南省高等学校青年骨干教师基金项目(0900304)

摘　　要：锌基合金是一种比较理想的高温无铅软钎料,但是锌基钎料的润湿性比较差,严重阻碍了其推广和应用。活性剂可以提高钎料的润湿性,本文研究了在常用的锌基助焊剂中,不同比例的活性剂含量对锌基钎料助焊剂的物理性能及Zn20Sn钎料的铺展性能的影响。研究结果表明:当添加的活性剂质量分数为3%左右时,助焊剂的不粘性、腐蚀性、不挥发物含量、稳定性均满足国家标准,并且可以得到饱满、平整、光滑的钎焊接头。Zinc-based alloy is considered to be an ideal high-temperature lead-free solder.The property of poor wettability of zinc-based alloy hinders the application of the zinc-based alloy.This paper studied the effect of different content of active agent on physical properties of the zinc-based flux and spreadability of Zn20Sn solder.The results show that the corrosive,non-adhesive and spreading of the zinc-based flux meet the national standard when the content of active agent is 3%.Zn20Sn solders exhibit excellent wettability,and the solder joints are smooth,bright and no obvious defects.

关 键 词：活性剂 助焊剂 Zn20Sn 钎料 润湿性 

分 类 号：TG425[金属学及工艺—焊接]