等温时效对SnAg/Cu表面贴装焊点微结构及剪切强度的影响  

EFFECT OF AGING ON THE MICROSTRUCTURE AND SHEAR STRENGTH OF EUTECTIC SnAg/Cu SURFACE MOUNT SOLDER JOINT

作　　者：肖克来提[1] 盛玫[1] 罗乐 

机构地区：[1]中国科学院上海冶金研究所-戴姆勒克莱斯勒联合电子封装研究实验室,上海200050

出　　处：《金属学报》2000年第7期697-702,共6页Acta Metallurgica Sinica

摘　　要：研究了等温时效对 ＳｎＡｇ／Ｃｕ表面贴装焊点微结构， Ｓｎ－Ｃｕ金属间化合物生长及其剪切强度的影响，并与常用的６２Ｓｎ３６Ｐｂ２Ａｇ／Ｃｕ焊点进行了比较，结果表明，在时效过程中， ＳｎＡｇ钎料以较小的反应速率与 Ｃｕ发生反应 ＳｎＡｇ焊点显示了较强的剪切强度并且其受时效的影响较The effect of aging on the microstructure and shear strength of SnAg/Cu surface mount solder joint was investigated with comparison to 62Sn36Pb2Ag/Cu. It was found that the reaction rate between SnAg and Cu is smaller compared with SnPbAg and the shear strength of SnAg solder joint is higher and not so sensitive to the aging process.

关 键 词：表面贴装 等温时效 SnAg/Cu 剪切强度 

分 类 号：TG425.2[金属学及工艺—焊接]