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作 者:ZHU HongLiang MA Li LIANG Song ZHANG Can WANG BaoJun ZHAO LingJuan WANG Wei
机构地区:[1]Key Laboratory of Semiconductor Materials Science,Institute of Semiconductors,Chinese Academy of Sciences [2]Department of Electronic Engineering,Tsinghua University
出 处:《Chinese Science Bulletin》2013年第7期573-578,共6页
基 金:supported by the National Hi-Tech Research and Development Program of China ("863" Project)(Grant Nos. 2011AA010303,2012AA012203);the National Basic Research Program of China ("973" Project)(Grant No. 2011CB301702);the National Natural Science Foundation of China (Grant Nos. 61021003,61090392)
摘 要:The techniques used for the fabrication of photonic integrated circuit(PIC) chip are introduced briefly.Then a four channel DFB laser array integrated with MMI coupler and semiconductor optical amplifier(SOA) fabricated with butt-joint technique,varied ridge width and holographic exposure techniques is reported.The techniques used for the fabrication of photonic integrated circuit (PIC) chip are introduced briefly. Then a four channel DFB laser array integrated with MMI coupler and semiconductor optical amplifier (SOA) fabricated with butt-joint technique, varied ridge width and holographic exposure techniques is reported.
关 键 词:光子集成电路 激光器阵列 耦合器 MMI DFB INP基 半导体光放大器 对接技术
分 类 号:TN929.11[电子电信—通信与信息系统] TN248.4[电子电信—信息与通信工程]
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