工艺参数对空调电路固定板的翘曲变形和体积收缩的影响研究  

Effect of Process Parameters on Warpage and Volumetric Shrinkage of Air Conditioning Fixed Circuit Board

作　　者：周浩文[1] 李江平[1] 

机构地区：[1]广东工业大学,广东广州510006

出　　处：《塑料工业》2013年第2期57-60,共4页China Plastics Industry

摘　　要：以空调电路固定板为研究对象,结合Moldflow软件模拟和Taguchi正交试验设计得到对应制品的翘曲变形量和体积收缩率。采用均值分析和方差分析研究各参数对制品翘曲变形量和体积收缩率的影响程度,并获得较为理想的最佳工艺参数组合。Taking air conditioning circuit fixed plate as research object, the warpage and volumetric shrinkage were obtained by using Taguchi orthogonal experimental design method with simulation of Moldflow software. Effects of process parameters on warping deformation and volume shrinkage were studied by average analysis and variance analysis, and ideal combination of optimum parameters was obtained.

关 键 词：Taguchi正交试验 MOLDFLOW软件 翘曲变形 体积收缩率 空调电路固定板 

分 类 号：TQ320.662[化学工程—合成树脂塑料工业]