DOE法在无铅波峰焊工艺优化中的应用研究  

Research of DOE in Process Optimization of Lead-free Wave Soldering

作　　者：刘晓剑[1] 王玲 万超 

机构地区：[1]哈尔滨工业大学深圳研究生院,广东深圳518129 [2]中国电器科学研究院有限公司,广东广州510300

出　　处：《电子工艺技术》2013年第1期10-13,43,共5页Electronics Process Technology

基　　金：国家科技支撑项目(项目编号:2011BAF11B04)

摘　　要：DOE作为一种优化产品和过程设计、加速设计开发周期、降低开发成本和研究与处理多因素实验的科学方法,开始在无铅波峰焊接工艺优化研究中逐渐崭露头角,显示出其独特的优越性。对无铅波峰焊工艺、DOE法及其在无铅波峰焊工艺优化中应用的研究现状进行了总结介绍。DOE （Design Of Experiment） as an scientific method of optimizing design of product and process, accelerating design and development cycle, reducing development costs, studying and processing of multi-factor experimental, has been used in the process optimization of lead-free wave soldering studies emerge, and shown its unique advantages. Summarize and introduce the lead-free wave soldering process, DOE method and the application of DOE in the process optimization of lead-free wave soldering.

关 键 词：DOE 无铅波峰焊 工艺优化 

分 类 号：TN605[电子电信—电路与系统]